Seagate said in its recent fiscal second-quarter earnings report that it expects the flooding in Thailand to result in a continued hard drive shortage throughout 2012. The company originally reported issues after flooding affected its factories in October, 2011. In addition, analysts have suggested that the floods could increase laptop and desktop PC prices, and hurt overall sales for major computer vendors. Seagate said that it shipped 47 million hard drives during the second fiscal quarter of 2012, which was down just 4% from the same quarter last year. The company confirmed in its earning statement that it has already secured long-term deals to make sure prices don’t inflate further. 

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Sony on Monday announced its latest and thinnest back-illuminated CMOS image sensor that will no doubt help manufacturers create thinner smartphones. “Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors,” Sony explained in its announcement. “By this stacked structure, large-scale circuits can now be mounted keeping small chip size.” The chip’s features include:

• Large-scale signal processing circuits required for higher image quality and better functionality are built-in
• More compact image sensor chip size
• Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
• Faster speeds and lower power consumption by adopting the leading process for the circuit section

Sony will begin shipping samples to manufacturers in March. The company’s full press release follows after the break.

Sony Develops Next-generation Back-Illuminated CMOS Image Sensor which Embodies the Continuous Evolution of the Camera Expanding Shooting Enjoyment and Advanced Functionality of Smartphones and Other Devices -

Tokyo, Japan – January 23, 2012 – Sony Corporation (“Sony”) today announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution of the camera. This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. This structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.

Hereafter, Sony will position it as the next generation back-illuminated CMOS image sensors, and unwaveringly strive to further develop this image sensor and expand its product lineup, thereby contributing to the further development of user-friendly cameras and to shooting enjoyment.

Features of stacked CMOS image sensor

• Large-scale signal processing circuits required for higher image quality and better functionality are built-in
• More compact image sensor chip size
• Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
• Faster speeds and lower power consumption by adopting the leading process for the circuit section

Background of development

The popularization of smartphones and other devices in recent years has been accompanied by an increasingly diverse use of camera functionality. This has brought heightened demand for more sophisticated cameras, to ensure adaptability to a wider range of scenes and Sony developed this stacked CMOS image sensor to meet such demand. In addition to the higher pixel numbers, superior image quality and faster speeds which conventional image sensors pursued, the newly-developed image sensors further achieve more highly-advanced functionalities and a more compact size, thus paving the way for enhanced camera evolution.
As the first step towards the commercialization of its new CMOS image sensors, Sony has developed a model with built-in signal processing functionality, an element that usually requires external embedment. Samples will be shipped from March, 2012. Accordingly, models have been developed with Sony’s unique “RGBW Coding” function, which facilitates low noise, high quality image capture even in low light condition, and the proprietary “HDR (High Dynamic Range) Movie” function, which achieves brilliant color even when taking pictures against bright light.

About stacked CMOS image sensors
Conventional CMOS image sensors mount the pixel section and analog logic circuit on top of the same chip, which require numerous constraints when wishing to mount the large-scale circuits such as measures to counter the circuit scale and chip size, measures to suppress noise caused by the layout of the pixel and circuit sections, and optimizing the characteristics of pixels and circuit transistors.

Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors. By this stacked structure, large-scale circuits can now be mounted keeping small chip size. Furthermore, as the pixel section and circuit section are formed as independent chips, a manufacturing process can be adopted, enabling the pixel section to be specialized for higher image quality while the circuit section can be specialized for higher functionality, thus simultaneously achieving higher image quality, superior functionality and a more compact size. In addition, faster signal processing and lower power consumption can also be achieved through the use of leading process for the chip containing the circuits.

Not long ago we published a story about Raspberry Pi, a $35 Linux-based single board computer that is still in development. Now, a Model B version of the device is being demoed and it shows off the small computer’s AirPlay streaming capabilities. The video shows one of Raspberry Pi’s developers using an iPad to stream a video clip to the Raspberry Pi Model B device using AirPlay without a hitch. The developers behind the tiny and affordable computer have said they hope the gadget will eventually be used in schools, although it’s still unclear when the company will begin shipping devices to consumers. A video of Model B working seamlessly with AirPlay follows after the break.

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We just met with Corning during CES in Las Vegas to check out its new Gorilla Glass 2 panels for smartphones and tablets. The new glass is 20% thinner than before, but just as strong and scratch resistant as the original Gorilla Glass. The thinner build will surely help manufacturers make smaller and lighter smartphones. We stayed to watch a pressure test, images of which are in the gallery below, and were impressed with the strength of the glass. Corning said that it’s already shipping the new panels to phone manufacturers and that we will see smartphones on the market soon with the new glass. We were also told that Gorilla Glass 2 will be used in new Windows-powered computers later this year. Be sure to check out our gallery below.

Intel could be preparing to unveil most of its next-generation 22nm Ivy Bridge processors ”on or around” April 8th according to a recent rumor. The company is set to introduce 25 different models in total, DigiTimes reported, including 17 chips designed for use in desktop PCs and eight for notebooks and ultrabooks. Intel will announce the following desktop processors in April according to the report: the Core i7-3770K, 3770, 3770S, 3770T as well as the Core i5-3570, 3550 and 3450. The desktop processors will reportedly range in price from $184 to $332. The following notebook CPUs will also be announced: Core i7-3920Qm ($1,096), 3820QM ($568) and the 3720QM ($378). Intel is allegedly working on the Core i5-3520M, 3360M, 3320M for notebooks and the Core i7-3667U and Core i5-3427U for ultrabooks, but those processors may not be announced at the same time; the company is expected to unveil several other models for both notebooks and desktops in May. Intel has said its Ivy Bridge chips will offer a 37% performance increase over its 32nm chips.

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Samsung on Wednesday announced the Exynos 5250, the company’s latest system-on-a-chip (SoC), which packs two ARM Cortex-A15 processors clocked at 2GHz. Samsung said the dual-core chip, which will be used primarily in high-end tablets, offers about twice the CPU performance of its existing products that are equipped with a pair of ARM’s 1.5GHz Cortex-A9 processors. The Exynos 5250 supports 2560 x 1600-pixel resolution displays and also offers more than four times the graphics performance of existing ARM Cortex-A9 chips. Samsung expects to mass produce the Exynos 5250 during the second quarter of 2012. The full press release, translated from Korean to English, follows after the break.

Samsung Electronics, the industry’s first Cortex-A15-based development of the mobile AP

- The industry’s first Cortex-A15 core applied 2.0GHz ‘Exynos 5250′
- The industry’s first ultra-high resolution WQXGA (2560 * 1600) display support

CHANDLER, Ariz. – (BUSINESS WIRE) – November 30, 2011 – Samsung Electronics, the industry’s first next-generation Cortex-A15 equipped with 2.0GHz (gigahertz), high-performance dual-core mobile AP ‘Exynos 5250′ was developed.

‘Exynos 5250′ a 32-nm low-power HKMG (high-k metal gate, High-K Metal Gate) process was applied, one can process two instructions per second by 14 billion (14,000 DMIPS) based on the existing 1.5GHz dual Cortex-A9 Core Products (7,500 DMIPS), compared to about twice the CPU performance has been improved.

Primarily in high-end tablet PC mounted ‘Exynos 5250′ which evolved into a high-resolution ultra-high resolution according to the tablet market trends WQXGA (2560 * 1600) displays are supported.

In addition, when implementing a still image of the mobile device of the AP without additional signal transmission timing of the display screen with the images stored in the controller itself implements (Panel Self Refresh feature) at the system level power consumption is reduced.

‘Exynos 5250′ 3D graphics performance for 3D graphics processing speed significantly strengthen the existing Cortex-A9 based products has been improved compared to the more than four times. Stereoscopic 3D display in mobile environments (Stereoscopic 3D Display) and you can enjoy high-end 3D gaming is.

In particular, rapid data processing, 3D graphics, implementation, and support high resolution display of the most important memory bandwidth (Memory Bandwidth, per second, the ability to read and store data in memory) This 12.8GBytes/sec was improved by 2 times compared to existing products.

The Samsung Electronics ‘Exynos 5250′ release of the sample and mass production plans for the second quarter of next year.

Vice President of System LSI Division, Samsung Electronics yidojun the “Cortex-A15 with dramatically improved the processing power of next-generation mobile AP core,” said “Samsung Exynos 5250 users with low power and high performance of the mobile environment to provide a new level,” he said.

The team at iFixit recently tore open Barnes & Noble’s brand new Nook Tablet to get a closer look at its inner workings see how they compare to Amazon’s Kindle Fire. The group found that the Nook Tablet is powered by a dual-core TI OMAP 4 processor clocked at 1GHz, and it has 1GB of RAM and 16GB of internal SanDisk storage. It also has a 4,000 mAh battery under the hood that’s rated for up to 11.5 hours of reading time, 3.5 hours longer than the previous generation Nook Color device. The Nook Tablet received a repairability score of 6 out of 10 points, which is worse than the Kindle Fire’s 8/10 score. The LCD can be easily replaced because it isn’t fused to the bezel, however one would need to remove the motherboard in order to replace the battery, and there are “excessive amounts of adhesive” and even hidden screws that made the teardown a bit more tedious than usual.

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The group at iFixit recently tore open the Amazon Kindle Fire to get a good look at its hardware. The group discovered that the device is powered by a Texas Instruments OMAP 4430 processor clocked at 1GHz that is paired with an older Texas Instruments WL1270B 802.11 b/g/n Wi-Fi chip. Overall, the Kindle Fire didn’t have too many complicated parts, which resulted in a solid 8/10 repairability score from iFixit. The team said its rear case is easy to take off, users only need a regular screw driver to open the tablet, and the LCD isn’t fused to its the glass cover, which means it should be fairly easy to replace if it breaks. Unfortunately, however, the glass pane is fused to the bezel, and it will require a heat gun to separate the components. A video from DirectFix, another site that tore apart the Kindle Fire and examined its innards, follows after the break.

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Qualcomm announced Wednesday that it is now shipping its 4G LTE Gobi 4000 platform to OEMs. The platform combines its 3G/4G wireless modems, the MDM9600 and the MDM9200, and the Gobi API that will allow manufacturers to create devices with support for LTE/HSPA+ and LTE/EV-DO networks. “To make Gobi 4000 available to as many consumers as possible, Qualcomm has worked hard to ensure that OEMs can use the platform on many commonly used personal computing, tablet and e-reader operating systems, including Windows and Android, and hardware architectures, such as our powerful Snapdragon dual-core and quad-core processors,” Qualcomm CDMA Technologies senior vice president of product management Cristiano Amon said. Many manufacturers use Qualcomm’s Gobi technology, including Dell, Apple, Lenovo, Novatel and Sierra Wireless. Apple uses older Gobi technology in its CDMA iPad 2 and iPhone 4, which means it’s very possible that we’ll see Qualcomm’s Gobi 4000 platform used in a 4G iPhone and iPad. In addition to the Gobi 4000 announcement, Qualcomm announced 8 new S4 processors (the MSM8660A, MSM9260A, MSM8630, MSM8230, MSM8627, MSM8227, APQ8060A, and the APQ8030) that use the company’s Krait CPU. The chips were designed for next-generation smartphones and tablets and are expected to hit the market early next year. Read on for Qualcomm’s full Gobi 4000 press release.

Qualcomm Announces Commercial Availability of Gobi 4000 Platform for 4G LTE Connectivity

Fourth Generation Gobi Platform Provides High-speed 4G LTE Connectivity with Backward Compatibility to EV-DO and HSPA+ Networks

SAN DIEGO – November 15, 2011 – Qualcomm Incorporated (NASDAQ: QCOM) today announced availability of Gobi™ 4000, its latest addition to the Gobi family of embedded data connectivity platforms. Based on Qualcomm’s leading multimode 3G/4G wireless modems, the MDM9600™ and MDM9200™, and a common software interface (Gobi API) for connection management development, the Gobi 4000 platform allows customers to offer both LTE/HSPA+ and LTE/EV-DO designs to meet the growing demand for embedded 3G/4G connectivity in mobile devices worldwide. Gobi 4000-based modules are now available from Novatel Wireless and Sierra Wireless.

“Embedded modules based on our new Gobi 4000 technology are designed to give consumers an uncompromised mobile connectivity experience, both in terms of download speeds and flexibility,” said Cristiano Amon, senior vice president of product management for Qualcomm CDMA Technologies. “To make Gobi 4000 available to as many consumers as possible, Qualcomm has worked hard to ensure that OEMs can use the platform on many commonly used personal computing, tablet and e-reader operating systems, including Windows® and Android, and hardware architectures, such as our powerful Snapdragon™ dual-core and quad-core processors.”

Qualcomm’s latest Gobi-enabled 4G platform features the Gobi Application Programming Interface (API) with LTE extensions and is compatible with leading connectivity standards, including CDMA2000® 1xEV-DO Rev. A and B, HSPA+, dual-carrier HSPA+, and LTE with integrated backwards compatibility to HSPA and EV-DO. The Gobi 4000 platform also includes software enhancements for select MDM™ chipsets that enable a common software interface to help connect, locate and manage 3G/4G devices regardless of wireless interface and operating system. This interface will help streamline product development efforts, spur application development among third-party software developers, and deliver greater flexibility to device manufacturers.

As one of the largest providers of wireless chipset and software technology in the industry, Qualcomm has a diverse chipset and software product portfolio spanning multiple device classes. System designers now have the flexibility to choose an embedded Gobi 4000 platform for high-speed 4G LTE support, or an embedded Gobi 3000 platform for worldwide 3G connectivity. Qualcomm also offers its family of Snapdragon all-in-one processors with the option for integrated multimode 3G/4G, dual-band Wi-Fi®, Bluetooth, FM radio connectivity and differing numbers of CPU cores for the most power-efficient designs.

“Qualcomm’s Gobi 4000 platform provides the 4G LTE support our customers demand for mobility in Dell’s Latitude E6420 laptops,” said Kirk Schell, executive director and general manager of Dell’s Business Client Product Group. “We look forward to giving our customers fast 4G network connections and increased productivity with the addition of the Gobi 4000 modules to our mobile broadband technology offerings.”

“Combining the performance, security and reliability of our ThinkPad laptops with Qualcomm’s Gobi platform has proven to be a compelling solution for our customers,” said Dilip Bhatia, vice president, ThinkPad Marketing, Lenovo. “We look forward to continuing this tradition of delivering quality broadband mobile computing solutions with the addition of Qualcomm’s Gobi 4000 technology to our ThinkPad laptops’ connectivity options.”

“We are offering multiple 4G LTE platforms incorporating Qualcomm’s Gobi 4000 technology within our Expedite® Module portfolio,” said Rob Hadley, CMO, Novatel Wireless. “With our long-standing tier-one carrier and OEM relationships and our leading design, integration and certification expertise, we are excited to help our customers bring commercial 4G LTE-capable laptops, tablets and the rapidly growing number of other devices requiring 4G connectivity to market.”

“Sierra Wireless has been using Qualcomm’s Gobi technology in our embedded wireless modules for quite some time, including in our AirPrime™ MC7700, MC7710 and MC7750 modules for LTE networks, which we introduced late last year,” said Dan Schieler, senior vice president and general manager, Mobile Computing for Sierra Wireless. “Our customers value the performance and flexibility that Gobi technology offers, and we are pleased to continue our collaboration with Qualcomm to provide the new Gobi 4000 technology in our product line.”

NVIDIA has finally announced its quad-core ARM Cortex A9 Tegra 3 processor, previously codenamed “Kal-El,” that will deliver “PC-class performance” for tablets and smartphones. NVIDIA said the new chip will offer 3 times the graphics performance of its dual-core Tegra 2 chip and it will consume up to 61% less power. If a user is listening to music or using a phone in a way that does not demand a lot of power, the new chip will automatically throttle down to use a companion core. Once a user fires up a game, browses the Web, or performs a task that needs the extra power, the Tegra 3 processor disables the companion core and activates all four processing cores. In addition to the four cores and the companion core, Tegra 3 also has a 12-core GeForce graphics processing unit with support for stereoscopic 3D, new video engines for playing 1080p HD video and more. NVIDIA said Tegra 3 is in production now and one of the first products to ship with it will be the Asus Eee Pad Transformer Prime. Read on for the full press release and a video that shows off the chip’s gaming capabilities.

NVIDIA Quad-Core Tegra 3 Chip Sets New Standards of Mobile Computing Performance, Energy Efficiency

 Tegra 3’s fifth ‘companion’ core enables ultra-low power consumption, while advanced quad-core processors drive record-breaking performance

SANTA CLARA, Calif.—Nov. 8, 2011— NVIDIA today ushered in the era of quad-core mobile computing with the introduction of the NVIDIA® Tegra® 3 processor, bringing PC-class performance levels, better battery life and improved mobile experiences to tablets and phones.  The world’s first quad-core tablet with the Tegra 3 processor is the ASUS Eee Pad Transformer Prime.

Known previously by the codename “Project Kal-El,” the Tegra 3 processor provides up to 3x the graphics performance of Tegra 2, and up to 61 percent lower power consumption. This translates into an industry-leading 12 hours of battery life for HD video playback.

The Tegra 3 processor implements a new, patent-pending technology known as Variable Symmetric Multiprocessing (vSMP). vSMP includes a fifth CPU “companion”, specifically designed for work requiring little power. The four main cores are specifically designed for work requiring high performance, and generally consume less power than dual-core processors.

During tasks that require less power consumption – like listening to music, playing back video or updating background data – the Tegra 3 processor completely shuts down its four performance-tuned cores and, instead, uses its companion core. For high-performance tasks – like web browsing, multitasking and gaming – the Tegra 3 processor disables the companion.

“NVIDIA’s fifth core is ingenious,” said Nathan Brookwood, Research Fellow at Insight 64. “Tegra 3’s vSMP technology extends the battery life of next-generation mobile devices by using less power when they’re handling undemanding tasks and then ratcheting up performance when it’s really needed.”

The Tegra 3 quad-core CPUs are complemented with a new 12-core NVIDIA GeForce® GPU, which delivers more realism with dynamic lighting, physical effects and high resolution environments, plus support for 3D stereo, giving developers the means to bring the next generation of mobile games to life.

For the millions who play games on mobile devices, the Tegra 3 processor provides an experience comparable to that of a game console. It offers full game-controller support, enabling consumers to play games on their tablet or super phone, or connect to big screen HDTVs for a truly immersive experience. It also leverages NVIDIA’s award-winning 3D Vision technology and automatically converts OpenGL applications to stereo 3D, so consumers can experience 3D on a big screen 3D TV (via HDMI™ 1.4 technology).

The Tegra 3 processor provides the industry’s….

·         Fastest web experience – with accelerated Adobe Flash  Player 11, HTML5 and WebGL browsing, and an optimized Javascript engine

·         Fastest applications – with blazing performance for multimedia apps, such as photo and video editing

·         Fastest multitasking – for switching between common uses, such as playing music and games, and background tasks

·         Fastest, highest-quality gaming – including new Tegra 3 processor-optimized NVIDIA Tegra Zone™ app  games such as Shadowgun, Riptide GP, Sprinkle, Big Top THD, Bladeslinger, DaVinci THD and Chidori.

Highlights / Key Facts:

·         The Tegra 3 processor redefines power consumption and mobile-computing performance with:

o    The world’s first quad-core ARM Cortex A9 CPU

o    New patent-pending vSMP technology, including a fifth CPU core that runs at a lower frequency and operates at exceptionally low power

o    12-core GeForce GPU, with 3x the graphics performance of the Tegra 2 processor, including support for stereoscopic 3D

o    New video engines with support for 1080p high profile video at 40 Mbps

o    Up to 3x higher memory bandwidth

o    Up to 2x faster Image Signal Processor

·         40 games are expected to be available by the end of 2011, and over 15 Tegra 3 games are under development for Tegra Zone, NVIDIA’s free Android Market app that showcases the best games optimized for the Tegra processor.

·         The Tegra 3 processor is in production. Developers can order the Tegra 3 Developer Kit to create applications for devices with Tegra such as tablets and super phones, at developer.nvidia.com/tegra.

ARM announced the Cortex-A7 MPCore processor on Wednesday, which it is touting as its most power efficient mobile processor yet. The Cortex-A7 is just one-fifth the size of the Cortex-A8 but provides 5x the energy efficiency and greater performance. The single-core chip was designed for use in budget-friendly smartphones that will be priced under $100. ARM explained that it can create a system on a chip (SoC) with better performance and longer battery life by taking advantage of “Big.LITTLE” processing, which combines a Cortex-A15 MPCore with a Cortex-A7 processor. The first smartphones to use the new chip are expected to hit the market in 2013. Read on for the full press release from ARM.

ARM Unveils its Most Energy Efficient Application Processor Ever; Redefines Traditional Power And Performance Relationship With big.LITTLE Processing

19 October 2011

Addresses one of today’s industry challenges: extending consumers’ always on, always connected mobile experience with both improved performance AND longer battery life

Cambridge, UK – 19th October 2011 – ARM today announced the ARM® Cortex™-A7 MPCore™ processor – the most energy-efficient application class processor ARM has ever developed, and big.LITTLE processing – a flexible approach that redefines the traditional power and performance relationship. The Cortex-A7 processor builds on the low-power leadership established by the Cortex-A8 processor that is at the heart of many of today’s most popular smartphones. A single Cortex-A7 processor delivers 5x the energy-efficiency and is one fifth the size of the Cortex-A8 processor, while providing significantly greater performance. The Cortex-A7 processor will enable a rich user experience in sub-$100 entry level smartphones and help connect the next billion people in developing markets.

One of today’s technology most significant challenges is how to create a System on Chip (SoC) that meets the conflicting consumer demand for devices with both higher-performance AND extended battery life. Big.LITTLE processing, enabled by Cortex-A7, achieves this by pairing the best of the high-performance Cortex-A15 MPCore and ultra-efficient Cortex-A7 processors. Big.LITTLE processing allows devices to seamlessly select the right processor for the right task, based on performance requirements. Importantly, this dynamic selection is transparent to the application software or middleware running on the processors.

ARM Partners supporting these technologies include Broadcom, Compal, Freescale, HiSilicon, LG Electronics, Linaro, OK Labs, QNX, Redbend, Samsung, Sprint, ST-Ericsson and Texas Instruments. Quotes and video comments can be found below and at http://www.youtube.com/ARMflix

Mobile usage has changed significantly and today consumers are increasingly using their smartphone for the majority of their connected lives. This includes high-performance tasks, such as web browsing, navigation and gaming, and less demanding ‘always on, always connected’ background tasks, such as voice calls, social networking and email services. As a result, the mobile phone has become an indispensible compute device for many consumers. At the same time, new mobile form factors, such as tablets, are redefining computing platforms in response to consumer demand. This is creating new ways for consumers to interact with content and brings what was once only possible on a tethered device to the mobile world.

By developing big.LITTLE processing and the Cortex-A7 processor, ARM has addressed the challenge for technology that can deliver both high-performance, required for content creation and consumption, while also delivering extreme power efficiency for extended battery life. This is particularly pertinent as smartphones and tablets continue to evolve into the primary platforms that consumers use to interact with our increasingly connected world.

Cortex-A7 – extending ARM low-power leadership
The efficiency of the ARM architecture is the reason why ARM processors use less power and occupy a smaller footprint. The Cortex-A7 processor occupies less than 0.5mm2, using 28nm process technology, and provides compelling performance in both single and multicore configurations. Used as a stand-alone processor, the Cortex-A7 will deliver sub-$100 entry level smartphones in the 2013-2014 timeframe with an equivalent level of processing performance to today’s $500 high-end smartphones.

The ARM vision of the entry level smartphone market is to redefine usage in the developing world by helping connect the next billion people to Internet content and services over mobile devices.

Big.LITTLE processing – the right processor for the right job
Big.LITTLE processing combines two different, but compatible processors within the same SoC and allows the power management software to seamlessly select the right processor, or multiple processors, for the right task. The processors appear identical from an applications software perspective.

The ‘LITTLE’, lowest-power processor – in this case, the Cortex-A7 – runs the Operating System (OS) and applications for basic always-on, always connected tasks, such as social media and audio playback. The OS and apps can then be seamlessly migrated to the higher-performance processor as demands increase for high end tasks, such as navigation and gaming. The time for this migration is in the order of 20 microseconds.

This flexible approach of choosing the right processor for the right job enables highly optimized processing which results in significant energy savings for common workloads.

System IP and tools ensures coherency and optimization for multicore solutions
The efficient and seamless switching of workloads between the two processors is supported by advanced ARM system IP, such as AMBA® 4 ACE Coherency Extensions. This ensures full cache, I/O and processor-to-processor coherency between the Cortex-A15 and Cortex-A7, and across the complete system. Software and applications can therefore continue to run unhindered, and unnoticed by the user, as the tasks are rebalanced to provide the optimum big.LITTLE user experience.

Big.LITTLE power management software is developed by ARM ecosystem partners months ahead of silicon availability using ARM DS-5 tools and Fast Model virtual prototyping technology. The virtual platform, available now to lead partners, contains the Cortex-A15 and Cortex-A7 processors, as well as cache coherent interconnect System IP, allowing full system software development.

Samsung announced is Exynos 4212 processor on Thursday, a new dual-core ARM Cortex-A9 chip. Samsung said the 4212 offers a 25% increase in processing power, 50% higher 3D performance and “double the logic density and a 30% lower power-level over the previous process generation” chip, which currently powers most of its Galaxy S II smartphones. The Eynos 4212 will be used in both tablets and smartphones; currently, Samsung’s Galaxy Tab 10.1 and Galaxy Tab 8.9 run dual-core Tegra 2 chips from NVIDIA. The Exynos 4212 processor also supports 1080p HD video recording and playback. Samsung expects to begin sampling the Exynos 4212 during the fourth quarter of this year. The company also announced a new 16-megapixel CMOS image sensor for tablets and smartphones, as well as a 1.2-megapixel HD video module that will be included in future device for video chat. Read on for the full Exynos press release from Samsung.

Samsung Unveils its Next High-Performance Application Processor for Smartphone and Tablet Devices

Samsung Mobile Solutions Forum 2011

TAIPEI, Taiwan–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today introduced the latest addition to its Exynos product family – the Exynos 4212 – a dual core ARM Cortex™-A9 application processor, designed on Samsung’s advanced 32nm High-K Metal Gate (HKMG) low-power process. With best-in-class performance, the dual-core Exynos 4212 offers mobile device systems architects a new solution designed to support a high-quality user-experience and energy-efficient requirements of smartphones and tablet devices. Samsung’s new Exynos application processor is displayed at the eighth annual Samsung Mobile Solutions Forum held at the Westin Taipei.

“As innovative technologies appear on the mobile landscape, the market continues to embrace further developments and performance acceleration in mobile computing”

“As innovative technologies appear on the mobile landscape, the market continues to embrace further developments and performance acceleration in mobile computing,” said Seh-Woong Jeong, executive vice president of System LSI sales & marketing, Device Solutions, Samsung Electronics. “Samsung is addressing this trend with its powerful low-power Exynos family of processors based on its proven design technology and cutting-edge process technology for performance and power improvements at the system level.”

Leveraging its deep sub-micron expertise in high-performance/low-power technology, Samsung designed the Exynos 4212 on its 32nm low-power HKMG logic process technology with dual Cortex-A9 cores. Samsung’s 32nm HKMG process node is specifically tuned to offer a competitive, cutting-edge platform with double the logic density and a 30 percent lower power-level over the previous process generation.

In addition to the 25 percent increase in processing power, the new processor features an enhanced graphics processing unit (GPU) that is capable of delivering 50 percent higher 3D graphics performance over the previous processor generation from Samsung.

The Exynos 4212 incorporates a rich portfolio of advanced codec accelerators that support digital still images, video recording and play-back at 1080p full-HD resolution, an image signal processor and an on-chip HDMI 1.4 interface.

Samsung’s new Exynos 4212 application processor will be sampling to select customers in Q4 2011.

Samsung also launched a new website dedicated to its Exynos family of application processors. Designed to facilitate easy communication with industry partners and end users, the new micro site offers detailed product and event information as well as user experiences. More information can be found at www.samsung.com/exynos.

Broadcom on Monday announced the BCM2079x family of NFC chips which it hopes will spur the mass adoption of NFC. The 40nm-based chips are smaller and are reportedly the most power efficient solution currently available to device makers. Broadcom said the products use 40% fewer components on a 40% smaller surface area and consume 90% less power than competing models. The chips also support a new technology called “Maestro middleware” that allows developers to create NFC apps with support for Wi-Fi and Bluetooth. “Broadcom is committed to making NFC as ubiquitous as Bluetooth and Wi-Fi are today,” Broadcom vice president and general manager Craig Ochikubo said. “These solutions provide the features and performance that enable disruptive innovation that will reshape consumer experience.” Read on for Broadcom’s full press release.

Broadcom Introduces First NFC Chips in 40 NM to Drive Next Generation of Mobile Payments and Consumer Electronic Connectivity

Industry’s Smallest and Most Power Efficient NFC Solution with Seamless Connectivity to Bluetooth and Wi-Fi Opens Doors for Next Evolution of Wireless Innovation

News Highlights
New BCM2079x solutions are the industry’s first near field communications (NFC) chips manufactured in 40 nm CMOS process for smaller size and the industry’s lowest power consumption
Supports multiple embedded secure elements and/or SIM cards for contactless payment and secure applications.
Enables simplified connectivity with Wi-Fi and Bluetooth for new innovations in device-to-device data/video transfer, pairing and connections

BEIJING, Sept. 26, 2011 – P&T Expo Comm – Broadcom Corporation (Nasdaq: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today unveiled a new family of NFC chips designed to drive the mass deployment of NFC in consumer electronics devices. With a powerful combination of power, size and functional requirements, the new chips provide the advanced capabilities required by OEMs to ignite NFC adoption in consumer electronics. Visit Broadcom.com for more news from the show.

Manufactured in 40 nm CMOS technology, the new Broadcom® BCM2079x family slashes power consumption by more than 90 percent, uses 40 percent fewer components and has a 40 percent smaller board area, making it the smallest and most power efficient NFC solution on the market. The NFC controllers are platform agnostic with support for multiple secure elements or SIM cards – or both at the same time. In addition, Broadcom’s advanced MaestroTM middleware allows new NFC applications to utilize Bluetooth and Wi-Fi capabilities in the device to spur new innovations in user interface and media sharing.

An accelerated adoption of NFC could transform the use of smartphones, advancing beyond contactless mobile payments and ticketing to enable radically simplified connectivity between the handset and other devices like Bluetooth headsets and Wi-Fi-enabled digital televisions. The proliferation of NFC has the ability to expand the usefulness of smartphones and inspire a range of new applications built on the ability to create simple, secure connections between devices and enable services with a touch of the phone.

Technology Advantages:

Reduces power consumption:

o Low power target detection mode, which leverages Broadcom’s innovative low-power techniques, reduces polling power consumption by more than 90 percent for longer battery life
o Support for field power harvesting allows the chip to draw energy from the environment so it can support transactions even if the phone battery has expired

Reduces board space requirements and design complexity:
o Industry’s smallest size chip integrates more external components, reducing total solution bill of materials (BOM) costs
o Easily pairs with Broadcom’s InConcert® BCM4330 Bluetooth, Wi-Fi and FM combo chip for comprehensive connectivity solution
o Complete Broadcom software stack including MaestroTM middleware rounds out end-to-end solution for reduced design complexity, creative connectivity options and faster time to market

Provides support and flexibility for all business models and future wireless innovation:
o Only NFC controller to integrate transaction-based Application ID (AID) routing for simultaneous support of multiple secure elements (both SIM and non-SIM) within a single device
o Multiple SWP (single wire protocol) interfaces allow for standards-based SIM and embedded secure element integration
o Broadcom is also working closely with the NFC Forum to define and drive standards to ensure interoperability with other NFC devices

Craig Ochikubo, VP and GM, Wireless Personal Area Networks, Broadcom Corporation
“Broadcom is committed to making NFC as ubiquitous as Bluetooth and Wi-Fi are today. These solutions provide the features and performance that enable disruptive innovation that will reshape the mobile consumer experience. Our leadership and proficiency in wireless connectivity influenced the architecture of these new chips to meet the performance required by OEMs, allowing them to more easily add NFC to their designs.”

Intel has delayed its next-generation Cedar Trail Atom processors until November, DigiTimes reported on Monday. The company originally planned to launch its new 32nm chipsets in September but has pushed the launch due to graphics driver issues that have prevented the netbook/nettop platform from obtaining Microsoft’s Windows 7 certification. Cedar Trail’s 1.86GHz Atom N2800 and 1.6GHz Atom N2600 processors support DirectX 10.1, Intel Wireless Display, PC Sync, Fast Boot and Intel Wireless Music and will replace the aging Atom N455 and N475 chips. Intel’s nettop Cedar Trail processors, including the Atom D2700 and D2500, are also delayed until November according to the report.

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During the SIGGRAPH 2011 conference in Vancouver this week, a team comprised of researchers from various universities showed off a demo during a Microsoft Research presentation of how the Kinect Xbox 360 accessory can be used in the real world to create real-time dynamic 3D models. The project, dubbed “KinectFusion,” shows off the Kinect’s ability to render 3D models of an entire room nearly instantly as one researcher pans the accessory around. After the device has scanned the entire area, KinectFusion is capable of creating a 3D texture-mapped model of the entire room using a Kinect RGB image. The technology could be used to create highly immersive augmented reality games or, as TechNet points out, for architectural purposes on a budget. Hit the read link to see a video of KinectFusion in action.

[Via TechNet]

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